Senior Principal Engineer, Advanced Packaging & Integration
WhiteCrow Research·Singapore, Singapore
WhiteCrow Research is assisting a global semiconductor leader to fill a Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering role. You will develop advanced package technologies for post-fab wafer finish and assembly, and help drive manufacturing improvements. You will collaborate with multiple engineering teams, analyze data, perform DOE and SPC, and ensure quality from development to high-volume manufacturing. J-18808-Ljbffr
- Full-time
- SGD 1k–SGD 2k / yr
- Employment Pass — tied to employer